Liquid discharging apparatus, head unit, and control method of liquid discharging apparatus

ABSTRACT

Provided is a liquid discharging apparatus which includes a modulation circuit which generates a modulation signal which is obtained by pulse-modulating a source signal, a transistor which generates an amplified modulation signal by amplifying the modulation signal, a low pass filter which generates a drive signal by smoothening the amplified modulation signal, a piezoelectric element which is displaced by receiving the drive signal, and a circuit substrate on which the transistor is mounted. The transistor includes a first electrode, a second electrode, a third electrode, and a clip which has conductivity, is electrically connected to the first electrode. Furthermore, the circuit substrate has a first land corresponding to the first electrode, a second land corresponding to the second electrode, and a third land corresponding to the third electrode. In addition, a part of the clip is connected to the third land.

The entire disclosure of Japanese Patent Application No. 2014-040368,filed Mar. 3, 2014 is expressly incorporated by reference herein.

BACKGROUND

1. Technical Field

The present invention relates to a liquid discharging apparatus, a headunit, and a control method of the liquid discharging apparatus.

2. Related Art

An ink jet printer having piezoelectric elements has been known as anink jet printer which prints an image or a document by discharging ink.In a head unit, the piezoelectric elements are provided respectivelycorresponding to a plurality of nozzles. The respective piezoelectricelements are driven in accordance with drive signals, in such a mannerthat a predetermined amount of ink (liquid) is discharged from thenozzles at a predetermined time. As a result, dots are formed. In anelectrical point of view, the piezoelectric element is a capacitiveload, such as a capacitor. Thus, when a piezoelectric elementcorresponding to each nozzle is operated, it is necessary to supply anadequate amount of current to the piezoelectric element.

Therefore, a drive signal amplified by an amplifier circuit is suppliedto the head unit, in such a manner that the piezoelectric element isdriven. An example of the amplifier circuit includes an amplifiercircuit of a type in which a source signal not subjected toamplification is subjected to, for example, class ABcurrent-amplification (in other words, linear amplification) (seeJP-A-2009-190287). However, in the case of linear amplification,electric power consumption is large and energy efficiency is not good.Accordingly, in recent years, a configuration in which a source signalis subjected to class D amplification has been proposed (seeJP-A-2010-114711).

Meanwhile, in recent years, there has been a high demand for high-speedprinting and high-resolution printing of a printing apparatus. Toperform high-speed printing, the number of dots formed for each unittime may be increased. To perform high-resolution printing, the numberof dots formed for each unit area may be increased in a state where theamount of discharged ink from nozzles is set to be small. In otherwords, to perform high-speed and high-resolution printing, the number ofdots formed for each unit time and unit area may be increased. Thus, amethod in which an ink discharge frequency is increased is used.

Meanwhile, to increase an ink discharge frequency, it is necessary toincrease the frequency of a drive signal supplied to a piezoelectricelement. To perform a stable discharge operation in a state where thefrequency of a drive signal is increased and the influence by, forexample, residual oscillation, is reduced, it is necessary to increasethe switching frequency of class D amplification.

However, when the switching frequency is increased, the loss due toswitching is increased. Accordingly, the energy efficiency in class Damplification is reduced to be below the energy efficiency in linearamplification. As a result, it is not possible to ensure high energyefficiency which is an advantage of the class D amplification.

Furthermore, when switching in class D amplification is performed athigh frequency, a problem, such as an operational failure due to noiseand a heat generation due to switching loss, can occur.

As described above, when the switching frequency of class Damplification is increased to increase the frequency of a drive signalfor driving a piezoelectric element, various problems can occur.

SUMMARY

An advantage of some aspects of the invention is that, in aconfiguration in which a piezoelectric element is driven by a drivesignal subjected to class D amplification, a liquid dischargingapparatus capable of performing high-speed printing and high-resolutionprinting, a head unit, and a control method of the liquid dischargingapparatus are provided.

According to an aspect of the invention, there is provided a liquiddischarging apparatus which includes a modulation circuit whichgenerates a modulation signal which is obtained by pulse-modulating asource signal, a transistor which generates an amplified modulationsignal by amplifying the modulation signal, a low pass filter whichgenerates a drive signal by smoothening the amplified modulation signal,a piezoelectric element which is displaced by receiving the drivesignal, a cavity of which the internal volume changes in accordance withthe displacement of the piezoelectric element, a nozzle through whichliquid in the cavity is discharged in accordance with change in theinternal volume of the cavity, and a circuit substrate on which themodulation circuit, the transistor, and the low pass filter are mounted.The transistor includes a first electrode, a second electrode, a thirdelectrode, and a clip which has conductivity, is bonded to one surfaceof a die constituting the transistor, and is electrically connected tothe first electrode. The second electrode and the third electrode areprovided in the other surface of the die. Furthermore, the circuitsubstrate has a first land corresponding to the first electrode, asecond land corresponding to the second electrode, and a third landcorresponding to the third electrode. In addition, the first electrodeof the transistor is connected to the first land and the secondelectrode is connected to the second land. A part of the clip isconnected to the third land.

In this case, a parasitic inductance is reduced in the transistor, andthus the influence, such as overshoot, by voltage noise is prevented.Accordingly, the modulation signal (in other words, an amplifiedmodulation signal) as a switching signal can have a high frequency. As aresult, the frequency of the drive signal applied to the piezoelectricelement is increased, in such a manner that high-speed printing andhigh-resolution printing can be performed.

Furthermore, heat generated in the die is directly transferred to thecircuit substrate through the other surface of the die and, further, isindirectly transferred to the circuit substrate through one surface ofthe die, the clip, and the first land, in order. In other words, thegenerated heat is transferred to the circuit substrate through bothsurfaces of the die. As a result, heat dissipation efficiency of thetransistor can be increased.

A source signal means a signal, in other words, a signal not subjectedto modulation, functioning as the source of a drive signal definingdisplacement of the piezoelectric element. The source signal is a signalfunctioning as reference of the waveform of the drive signal. The sourcesignal and a defined signal may be analog signals or digital signals.The modulation signal is a digital signal which is obtained byperforming pulse-modulation (for example, pulse-width modulation,pulse-density modulation, and the like) on the source signal.

Generally, a low pass filter is constituted of an inductor (for example,a coil) and a capacitor. However, a low pass filter may further includea resistor. Alternatively, a low pass filter may be constituted of aresistor and a capacitor, without an inductor.

Meanwhile, in this case, the drive signal is generated by smootheningthe amplified modulation signal and the piezoelectric element isdisplaced by receiving the drive signal, in such a manner that liquid isdischarged from the nozzles. When the waveform of the drive signal whichis used for causing the liquid discharging apparatus to discharge, forexample, a small-sized dot is frequency-spectrum-analyzed, it ispossible to know that a frequency component of which the frequency isequal to or higher than 50 kHz is included in the drive signal. Togenerate such a drive signal including a frequency component of whichthe frequency is equal to or higher than 50 kHz, it is necessary to setthe frequency of a modulation signal (in other words, an amplifiedmodulation signal) to be equal to or higher than 1 MHz.

When the frequency of the modulation signal is set to be less than 1MHz, edges of the waveform of a reproduced drive signal are reduced insharpness, and thus the edges are rounded. In other words, the corner ofthe waveform is removed, and thus the waveform is rounded. When thewaveform of the drive signal is rounded, the displacement of thepiezoelectric element which is operated in accordance withascending/descending edges is reduced. As a result, trail-pulling at thetime of discharging or a discharge failure occurs, and thus the printingquality may be reduced.

Meanwhile, when the frequency of the modulation signal is set to behigher than 8 MHz, the resolution of the waveform of the drive signal isincreased. However, an increase in the switching frequency of atransistor leads to an increase in switching loss. As a result, lowpower-consumption properties and low heat-generation properties, whichare the superiorities of class D amplification to linear amplification,such as class AB amplification, are deteriorated.

Accordingly, in the liquid discharge apparatus, it is preferable thatthe frequency of the modulation signal be in the range of 1 MHz to 8MHz.

In the liquid discharging apparatus, it is preferable that, in thecircuit substrate, a through-hole be provided in an area in which thetransistor is mounted. Accordingly, the heat generated in the transistorcan be released by the wiring pattern through the first electrode, thesecond electrode, or the third electrode and, further, can be released,through the through-hole, by the wiring pattern of the other layer.

In the liquid discharging apparatus, it is preferable that the clip beconnected to the circuit substrate, in a state where the clip surroundsthe second electrode and the third electrode. Since the clip surroundsboth the second electrode and the third electrode, it is possible toobtain a kind of shielding effect.

In the liquid discharging apparatus, it is preferable that a signalbased on the modulation signal, the amplified modulation signal, or thedrive signal may be fed back to the modulation circuit, in such a mannerthat the modulation circuit generates the modulation signal. A drivesignal which reproduces, through the feedback, the source signal withfidelity can be output. In this case, the drive signal is a signal whichis obtained by smoothening the amplified modulation signal, and thus thevoltage amplitude of the drive signal is high. Accordingly, uponcomparison between a case where a difference between the drive signaland the source signal is directly calculated and a case where the drivesignal is subjected to attenuation, and then a difference between theattenuated drive signal and the source signal is calculated, the latteris preferable. A signal based on the drive signal means not a signalwhich directly shows the drive signal but a signal which indirectlyshows the drive signal, as described above.

The smaller the delay components in the fed-back drive signal are, thehigher the frequency of the modulation signal is. The modulation signal(in other words, the amplified modulation signal), in addition to thedrive signal, can be used as a feedback signal.

The invention can be realized by various aspects, such as a controlmethod of a liquid discharging apparatus and a head unit.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIG. 1 is a view illustrating the schematic configuration of a printingapparatus.

FIG. 2 is a block diagram illustrating the configuration of the printingapparatus.

FIG. 3 is a view illustrating the configuration of a discharge portionin a head unit.

FIGS. 4A and 4B are views illustrating the arrangement of nozzles in thehead unit.

FIG. 5 is an explanatory view of an operation of a selection controlportion in the head unit.

FIG. 6 is a view illustrating the configuration of the selection controlportion in the head unit.

FIG. 7 is a view illustrating decoded contents of a decoder in the headunit.

FIG. 8 is a view illustrating the configuration of a selection portionin the head unit.

FIG. 9 is a view illustrating drive signals which are selected by theselection portion.

FIG. 10 is a view illustrating the configuration of a driving circuit inthe printing apparatus.

FIG. 11 is an explanatory view of the operation of the driving circuit.

FIG. 12 illustrates a wiring pattern of a first layer of a print circuitsubstrate.

FIG. 13 illustrates a wiring pattern of a second layer of the printcircuit substrate.

FIG. 14 illustrates a wiring pattern of a third layer of the printcircuit substrate.

FIG. 15 illustrates a wiring pattern of a fourth layer of the printcircuit substrate.

FIG. 16 is a view illustrating the arrangement of elements in the printcircuit substrate.

FIG. 17 is a view illustrating the equivalent circuit of the drivingcircuit in the print circuit substrate.

FIG. 18 is a view illustrating the pin assignment of an LSI in thedriving circuit.

FIG. 19 is a cross-sectional view illustrating the configuration of athrough-hole in the print circuit substrate.

FIG. 20 is an enlarged view illustrating the vicinity of a transistor inthe print circuit substrate.

FIG. 21 is a perspective view illustrating the appearance of thetransistor.

FIGS. 22A and 22B are cross-sectional views illustrating theconfigurations of the transistor and the like.

FIG. 23 is a view illustrating the equivalent circuit of the transistor.

FIGS. 24A and 24B are views illustrating overshoot due to switching ofthe transistor.

FIG. 25 is a view illustrating the configuration of a capacitor whichconstitutes a smoothing filter.

FIG. 26 is an end view illustrating the mounted state of the capacitorand the like.

FIG. 27 is a view illustrating the equivalent circuit of the capacitor.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Hereinafter, an embodiment of the invention will be described withreference to the accompanying drawings.

A printing apparatus according to this embodiment is an ink jet printer,in other words, a liquid discharging apparatus, in which ink isdischarged in accordance with image data supplied from an external hostcomputer and a group of ink dots are formed in a printing medium, suchas a paper sheet, in such a manner that the image (which includesletters, graphics, and the like) corresponding to the image data isprinted.

FIG. 1 is a perspective view illustrating the schematic internalconfiguration of the printing apparatus.

A printing apparatus 1 includes a movement mechanism 3 which moves(reciprocates) a movable body 2 in a main scanning direction, asillustrated in FIG. 1.

The movement mechanism 3 has a carriage motor 31, a carriage guide shaft32, and a timing belt 33. The carriage motor 31 functions as a drivesource of the movable body 2. Both ends of the carriage guide shaft 32are fixed. The timing belt 33 extends substantially parallel to thecarriage guide shaft 32 and is driven by the carriage motor 31.

A carriage 24 of the movable body 2 is reciprocatably supported by thecarriage guide shaft 32. The carriage 24 is fixed to a part of thetiming belt 33. Accordingly, when the timing belt 33 is subjected toforward/reverse traveling by the carriage motor 31, the movable body 2reciprocates in a state where the movable body 2 is guided by thecarriage guide shaft 32.

A head unit 20 is provided in a part of the movable body 2, which is aportion facing a printing medium P. The head unit 20 is a member whichdischarges ink-droplets (liquid-droplets) through a plurality ofnozzles, as described below. Various control signals and the likes aresupplied to the head unit 20 through a flexible cable 190.

The printing apparatus 1 includes a transport mechanism 4 whichtransports, on a platen 40, the printing medium P in a sub-scanningdirection. The transport mechanism 4 includes a transport motor 41 and atransport roller 42. The transport motor 41 functions as a drive source.The transport roller 42 is rotated by the transport motor 41 andtransports the printing medium P in the sub-scanning direction.

When the printing medium P is transported by the transport mechanism 4,the head unit 20 discharges ink-droplets onto the printing medium P, insuch a manner that an image is formed on the surface of the printingmedium P.

FIG. 2 is a block diagram illustrating the electrical configuration ofthe printing apparatus.

In the printing apparatus 1, a control unit 10 and the head unit 20 areconnected through the flexible cable 190, as illustrated in FIG. 2.

The control unit 10 has a control portion 100, the carriage motor 31, acarriage motor driver 35, the transport motor 41, a transport motordriver 45, two driving circuits 50, and the head unit 20. When imagedata is supplied from the host computer, the control portion 100 of thecomponents described above outputs various control signals and thelikes, to control the other components.

Specifically, first, the control portion 100 supplies a control signalCtr1 to the carriage motor driver 35 and the carriage motor driver 35drives, in accordance with the control signal Ctr1, the carriage motor31. As a result, the movement of the carriage 24 in the main scanningdirection is controlled.

Second, the control portion 100 supplies a control signal Ctr2 to thetransport motor driver 45 and the transport motor driver 45 drives, inaccordance with the control signal Ctr2, the transport motor 41. As aresult, the movement of the transport mechanism 4 in the sub-scanningdirection is controlled.

Third, the control portion 100 supplies digital data dA to one of thetwo driving circuits 50 and supplies digital data dB to the other. Inthis case, the data dA decides the waveform of drive signal COM-A ofdrive signals supplied to the head unit 20 and the data dB decides thewaveform of a drive signal COM-B thereof.

The one of the driving circuits 50 analog-converts the data dA, and thenthe driving circuit 50 supplies, to the head unit 20, the drive signalCOM-A subjected to class-D amplification. The details of this will bedescribed below. Similarly, the other of the driving circuits 50analog-converts the data dB, and then the driving circuit 50 supplies,to the head unit 20, the drive signal COM-B subjected to class-Damplification.

Fourth, the control portion 100 supplies, to the head unit 20, a clocksignal Sck, a data signal Data, and control signals LAT and CH.

A selection control portion 210 and a plurality of groups, each of whichis constituted of a selection portion 230 and a piezoelectric element60, are provided in the head unit 20.

The selection control portion 210 instructs each selection portion 230to select either the drive signal COM-A or the drive signal COM-B (orselect neither drive signal), in accordance with, for example, a controlsignal supplied from the control portion 100. Subsequently, theselection portion 230 selects the drive signal COM-A or the drive signalCOM-B, in accordance with the instruction from the selection controlportion 210. Next, the selection portion 230 supplies the selectedsignal to one end of the piezoelectric element 60. In the accompanyingdrawings, the Vout represents the voltage of the drive signal.

In this example, a voltage V_(BS) is applied to the other ends of therespective piezoelectric elements 60, in which the voltage V_(BS) is acommon voltage.

The piezoelectric elements 60 are respectively provided corresponding tothe plurality of nozzles in the head unit 20. The piezoelectric element60 is displaced in accordance with the difference between a voltage Voutof the drive signal selected by the selection portion 230 and thevoltage V_(BS), in such a manner that the piezoelectric element 60discharges ink. Next, the configuration for discharging ink by drivingthe piezoelectric element 60 will be simply described.

FIG. 3 is a view illustrating the schematic configuration of a part ofthe head unit 20, which corresponds to one nozzle.

The head unit 20 includes the piezoelectric element 60, an oscillationplate 621, a cavity (pressure chamber) 631, a reservoir 641, and anozzle 651, as illustrated in FIG. 3. Among the components describedabove, the oscillation plate 621 functions as a diaphragm which issubjected to displacement (in other words, bending oscillation) by thepiezoelectric element 60, in such a manner that the oscillation plate621 expands or contracts the internal volume of the cavity 631 which isfilled with ink. In FIG. 3, the piezoelectric element 60 is disposed onthe upper surface of the oscillation plate 621. The nozzle 651 isprovided in a nozzle plate 632. The nozzle 651 is an opening portioncommunicating with the cavity 631.

The piezoelectric element 60 illustrated in FIG. 3 has a configurationin which a piezoelectric body 601 is interposed between a pair ofelectrodes 611 and 612. In the piezoelectric body 601 having theconfiguration described above, the central portion thereof in FIG. 3,along with the electrodes 611 and 612 and the oscillation plate 621, isbent in a vertical direction with respect to both end portions thereof,in accordance with the voltage applied by the electrodes 611 and 612.Specifically, when the voltage Vout of the drive signal is high, thepiezoelectric element 60 is bent upward. In contrast, when the voltageVout is low, the piezoelectric element 60 is bent downward. In theconfiguration described above, when the piezoelectric element 60 is bentupward, the internal volume of the cavity 631 expands. Thus, ink isdrawn from the reservoir 641. In contrast, when the piezoelectricelement 60 is bent downward, the internal volume of the cavity 631contracts. Thus, when the amount of contraction is adequate, ink isdischarged from the nozzle 651.

The configuration of the piezoelectric element 60 is not limited to theconfiguration illustrated in FIG. 3. Any configuration may be applied tothe piezoelectric element 60 as long as the piezoelectric element 60 isdeformed, in such a manner that liquid, such as ink, can be discharged.Furthermore, the piezoelectric element 60 is not limited to a bendingoscillation type. The piezoelectric element 60 may be a longitudinaloscillation type.

In the head unit 20, the piezoelectric element 60 is providedcorresponding to the cavity 631 and the nozzle 651. In FIG. 1, thepiezoelectric element 60 is also provided corresponding to the selectionportion 230. Accordingly, a group of the piezoelectric element 60, thecavity 631, the nozzle 651, and the selection portion 230 is providedfor each nozzle 651.

FIG. 4A is a view illustrating an example of the arrangement of thenozzles 651.

The nozzles 651 are arranged to be in, for example, two rows, asillustrated in FIG. 4A. Specifically, in one row of the nozzles 651, theplurality of nozzles 651 are arranged in the sub-scanning direction,spaced apart from each other by a pitch Pv. In terms of the two rows ofthe nozzles 651, the two rows are spaced apart in the main scanningdirection, by a pitch Ph. Furthermore, the two rows of the nozzles 651are staggered by half the pitch Pv.

When color printing is performed, a pattern corresponding to C (cyan), M(magenta), Y (yellow), K (black), or the like is applied to the nozzles651, along, for example, the main scanning direction. However, tosimplify the configuration, a case in which gradation is expressed in amonochromatic manner is described below.

FIG. 4B is an explanatory view of the basic resolution of imageformation by the nozzle arrangement illustrated in FIG. 4A. To simplifythe description, an example of a method (which will be referred to as afirst method) in which one ink-droplet discharge action is performed byeach nozzle 651, in such a manner that a dot is formed, is illustratedin FIG. 4B. A black circle represents a dot formed by landing ofink-droplet.

When the head unit 20 moves in the main scanning direction at a velocityv, a (main-scanning-directional) gap D between dots formed by landedink-droplets and the speed v satisfies the following relationship.

That is, when one dot is formed by one ink-droplet discharge action, thegap D between dots is a value (=v/f) obtained by dividing the speed v byan ink discharge frequency f. In other words, the gap D is a distance bywhich the head unit 20 moves in a period (1/f) in which ink-droplets arerepeatedly discharged.

In the example illustrated in FIGS. 4A and 4B, ink-droplets dischargedfrom the two rows of the nozzles 651 land on the printing medium P, in astate where the ink-droplets are aligned in rows while satisfying therelationship in which the pitch Ph is proportional to the gap D betweendots with a coefficient n. Accordingly, a gap between dots in thesub-scanning direction is half a gap between dots in the main scanningdirection, as illustrated in FIG. 4B. Needless to say, the arrangementof dots is not limited to the example illustrated in FIG. 4B.

Meanwhile, to achieve high-speed printing, the velocity v at which thehead unit 20 moves in the main scanning direction may be simplyincreased. However, when only the velocity v is increased, the gap Dbetween dots is increased. Thus, to achieve high-speed printing withensuring a certain degree of resolution, it is necessary to increase theink discharge frequency f such that the number of dots increases foreach unit time.

To increase resolution, the number of dots may be increased for eachunit area, apart from the printing speed. However, in a case where thenumber of dots is increased, when the amount of discharged ink is notsmall, adjacent dots are combined. Furthermore, when the ink dischargefrequency f is not increased, the printing speed is reduced.

To achieve high-speed printing and high-resolution printing, it isnecessary to increase the ink discharge frequency f, as described above.

Meanwhile, methods of forming dots on the printing medium P are asfollows. In the first method, one ink-droplet discharge action isperformed, in such a manner that one dot is formed. In a second method,two or more ink-droplet discharge actions can be performed for each unittime period and two or more ink-droplets discharged in the unit timeperiod land on a printing medium, and then the two or more landedink-droplets are combined, in such a manner that one dot is formed. In athird method, two or more landed ink-droplets are not combined, in sucha manner that two or more dots are formed. In the following description,a case in which dots are formed by the second method will be explained.

In this embodiment, the second method will be described with theassumption explained below. In other words, in this embodiment, when onedot is formed, the ink discharge action is performed twice at most, insuch a manner that four gradation steps are expressed by a large-sizeddot, a medium-sized dot, a small-sized dot, and non-recording. In thisembodiment, to express the four gradation steps, two drive signals whichare the drive signal COM-A and the drive signal COM-B are provided and,further, both a preceding half pattern and a successive half pattern areprovided in each drive signal for each period. During each period,either the drive signal COM-A or the drive signal COM-B (or neithersignal) is selected in the preceding half period in accordance with thegradation to be expressed and, further, either (or neither) drive signalis selected in the successive half period. Then, the selected drivesignal is supplied to the piezoelectric element 60.

Here, the drive signals COM-A and COM-B will be described and thedescription of the configuration for selecting the drive signal COM-A orthe drive signal COM-B will be followed. Both the drive signals COM-Aand the drive signal COM-B are generated by the driving circuits 50. Forconvenience of description, the configuration for selecting the drivesignal COM-A or the drive signal COM-B will be described and thedescription of the driving circuit 50 will be followed.

FIG. 5 is a view illustrating the waveforms of the drive signals COM-Aand COM-B and the likes.

The drive signal COM-A has a waveform in which a trapezoidal waveformAdp1 and a trapezoidal waveform Adp2 are repeated, as illustrated inFIG. 5. In a printing period Ta, the trapezoidal waveform Adp1 isprovided in a time period T1 which is a period from a time at which thecontrol signal LAT is output (rises) to a time at which the controlsignal CH is output. Furthermore, in the printing period Ta, thetrapezoidal waveform Adp2 is provided in a time period T2 which is aperiod from a time at which the control signal CH is output to a time atwhich a successive control signal LAT is output.

In this embodiment, the trapezoidal waveforms Adp1 and Adp2 have thesubstantially same shape. When the trapezoidal waveform Adp1 or Adp2 issupplied to one end of the piezoelectric element 60, a predeterminedamount (specifically, a moderate amount) of ink is discharged from thenozzle 651 corresponding to the piezoelectric element 60.

The drive signal COM-B has a waveform in which a trapezoidal waveformBdp1 and a trapezoidal waveform Bdp2 are repeated. The trapezoidalwaveform Bdp1 is provided in the time period T1 and the trapezoidalwaveform Bdp2 is provided in the time period T2. In this embodiment, thetrapezoidal waveforms Bdp1 and Bdp2 have different shapes. Thetrapezoidal waveform Bdp1 is a waveform which is used for causing ink inthe vicinity of the opening portion of the nozzle 651 to finelyoscillate such that an increase in the viscosity of the ink isprevented. Accordingly, even when the trapezoidal waveform Bdp1 issupplied to one end of the piezoelectric element 60, an ink-droplet isnot discharged from the nozzle 651 corresponding to the piezoelectricelement 60. The trapezoidal waveform Bdp2 is a waveform having a shapedifferent from that of the trapezoidal waveform Adp1 (or Adp2). When thetrapezoidal waveform Bdp2 is supplied to one end of the piezoelectricelement 60, an amount of ink, which is the amount smaller than thepredetermined amount, is discharged from the nozzle 651 corresponding tothe piezoelectric element 60.

In the trapezoidal waveform Adp1, Adp2, Bdp1, or Bdp2, the voltage atthe start time and the voltage at the end time are the same voltage(which is a voltage Vc). In other words, the trapezoidal waveform Adp1,Adp2, Bdp1, or Bdp2 starts at the voltage Vc and finishes at the voltageVc.

FIG. 6 is a view illustrating the configuration of the selection controlportion 210 in FIG. 2.

The clock signal Sck, the data signal Data, and the control signals LATand CH are supplied from the control unit 10 to the selection controlportion 210, as illustrated in FIG. 6. In the selection control portion210, groups of shift registers (S/R) 212, latch circuits 214, anddecoders 216 are provided in a state where the groups respectivelycorrespond to the piezoelectric elements 60 (in other words, the nozzles651).

When a dot of an image is formed, the data signal Data decides the sizeof the dot. In this embodiment, the data signal Data is two-bit datacomposed of a high-order bit (in other words, MSB) and a low-order bit(in other words, LSB) such that the four gradations are expressed bynon-recording, a small-sized dot, a medium-sized dot, and a large-sizeddot.

When the head unit 20 performs a main scanning operation, the datasignal Data is synchronized with the clock signal Sck and is supplied,in series, from the control portion 100 to the respective nozzles. Tocorrespond to each nozzle, the shift register 212 temporarily holds twobits of the data signal Data which is supplied in series.

Specifically, the shift registers 212 of which the number of stagescorresponds to the number of piezoelectric elements 60 (in other words,nozzles) are cascade-connected to each other. The data signal Datasupplied in series is transmitted, in order, to the shift registers 212of successive stages, in accordance with the clock signal Sck.

To distinguish the shift registers 212 from one another, when the numberof piezoelectric elements 60 is m (in this embodiment, m is a pluralnumber), reference letters of a first stage, a second stage, etc. to anm_(th) stage are given in order, from an upstream-side shift register212 to a downstream-side shift register 212, in which the data signalData is supplied in order, from the upstream-side shift register 212 tothe downstream-side shift register 212.

When the control signal LAT rises, the latch circuit 214 latches thedata signal Data which is held in the shift register 212.

The decoder 216 decodes two bits of the data signal Data, which islatched by the latch circuit 214. Next, the decoder 216 outputs selectsignals Sa and Sb for every time period T1 or T2 which is defined byboth the control signal LAT and the control signal CH. Accordingly,selection by the selection portion 230 is decided.

FIG. 7 is a view illustrating the contents decoded by the decoder 216.

In FIG. 7, the two latched bits of the print data Data are expressed by(MSB, LSB). When the print data Data is, for example, (0, 1), this meansthat the decoder 216 causes the logic levels of the select signals Saand Sb to be set as follows. In the time period T1, the logic level ofthe select signal Sa is set to H and that of the select signal Sb is setto L. Furthermore, in the time period T2, the logic level of the selectsignal Sa is set to L and that of the select signal Sb is set to H.

A level shifter (not illustrated) causes the logic levels of the selectsignals Sa and Sb to be shifted to the high-amplitude logic levels,compared to the logic level of the clock signal Sck, the print dataData, the control signal LAT, or the control signal CH.

FIG. 8 is a view illustrating the configuration of the selection portion230 in FIG. 2, in which the selection portion 230 corresponds to onepiezoelectric element 60 (in other words, one nozzle 651).

The selection portion 230 has inverters (NOT circuits) 232 a and 232 band transfer gates 234 a and 234 b, as illustrated in FIG. 8.

The select signal Sa is supplied from the decoder 216 to a positivecontrol terminal of the transfer gate 234 a. In FIG. 8, the positivecontrol terminal is on the side of the transfer gate 234 a, to which acircular mark is not applied. Furthermore, the select signal Sa issubjected to logic inversion by the inverter 232 a, and then thelogic-inverted select signal Sa is supplied to a negative controlterminal of the transfer gate 234 a. In FIG. 8, the negative controlterminal is on the side of the transfer gate 234 a, to which a circularmark is applied. Similarly, the select signal Sb is supplied to apositive control terminal of the transfer gate 234 b. Furthermore, theselect signal Sb is subjected to logic inversion by the inverter 232 b,and then the logic-inverted select signal Sb is supplied to a negativecontrol terminal of the transfer gate 234 b.

The drive signal COM-A is supplied to the input terminal of the transfergate 234 a and the drive signal COM-B is supplied to the input terminalof the transfer gate 234 b. The output terminals of the transfer gates234 a and 234 b are connected to each other and, further, are connectedto one end of the piezoelectric element 60 corresponding to the transfergates 234 a and 234 b.

When the logic level of the select signal Sa is H, the input terminaland the output terminal of the transfer gate 234 a are conducted (set toan ON state). Furthermore, when the logic level of the select signal Sais L, the input terminal and the output terminal are not conducted (setto an OFF state). Similarly to in the case of the transfer gate 234 a,the input terminal and the output terminal of the transfer gate 234 bare conducted or not conducted (set to the ON state or the OFF state),in accordance with the logic level of the select signal Sb.

Next, operations of both the selection control portion 210 and theselection portion 230 will be described with reference to FIG. 5.

The data signal Data is synchronized with the clock signal Sck and issupplied, in series, from the control portion 100 to the respectivenozzles. The data signal Data is transmitted, in order, to the shiftregisters 212 corresponding to the respective nozzles. Then, when thecontrol portion 100 stops supplying of the clock signal Sck, the datasignal Data corresponding to each nozzle is held by each shift register212. Items of data signal Data are supplied in an order in which theitems of data signal Data respectively correspond to the nozzlescorresponding to the last m_(th)-stage shift register 212, . . . , thesecond-stage shift register 212, and the first-stage shift register 212.

In this case, when the control signal LAT rises, the respective latchcircuits 214 latch, at the same time, the data signal Data held by theshift registers 212. In FIG. 5, L1, L2 and so on to Lm express the datasignal Data latched by the latch circuits 214 which respectivelycorrespond to the first-stage shift register 212, the second-stage shiftregister 212 and so on to the m_(th)-stage shift register 212.

The decoder 216 outputs, in accordance with the size of dot defined bythe latched data signal Data, the logic levels of the select signals Saand Sb for every time period T1 or T2. The contents of the logic levelsof the select signals Sa and Sb are as illustrated in FIG. 7.

In other words, first, when the data signal Data is (1, 1), and thus alarge-sized dot is decided, the decoder 216 causes the logic levels ofthe select signals Sa and Sb to be set as follows. In the time periodT1, the logic level of the select signal Sa is set to H and the logiclevel of the select signal Sb is set to L. Similarly, in the time periodT2, the logic level of the select signal Sa is set to H and the logiclevel of the select signal Sb is set to L. Second, when the data signalData is (0, 1), and thus a medium-sized dot is decided, the decoder 216causes the logic levels of the select signals Sa and Sb to be set asfollows. In the time period T1, the logic level of the select signal Sais set to H and the logic level of the select signal Sb is set to L.Furthermore, in the time period T2, the logic level of the select signalSa is set to L and the logic level of the select signal Sb is set to H.Third, when the data signal Data is (1, 0), and thus a small-sized dotis decided, the decoder 216 causes the logic levels of the selectsignals Sa and Sb to be set as follows. In the time period T1, the logiclevel of the select signal Sa is set to L and the logic level of theselect signal Sb is set to L. Furthermore, in the time period T2, thelogic level of the select signal Sa is set to L and the logic level ofthe select signal Sb is set to H. Fourth, when the data signal Data is(0, 0), and thus non-recording is decided, the decoder 216 causes thelogic levels of the select signals Sa and Sb to be set as follows. Inthe time period T1, the logic level of the select signal Sa is set to Hand the logic level of the select signal Sb is set to H. Furthermore, inthe time period T2, the logic level of the select signal Sa is set to Land the logic level of the select signal Sb is set to L.

FIG. 9 is a view illustrating the voltage waveform of a drive signalwhich is selected in accordance with the data signal Data and issupplied to one end of the piezoelectric element 60.

When the data signal Data is (1, 1), the logic level of the selectsignal Sa is H during the time period T1 and the logic level of theselect signal Sb is L. Accordingly, the transfer gate 234 a is turned onand the transfer gate 234 b is turned off. Thus, the trapezoidalwaveform Adp1 of the drive signal COM-A is selected in the time periodT1. Similarly, in the time period T2, the logic level of the selectsignal Sa is H and the logic level of the select signal Sb is L. Thus,in the time period T2, the selection portion 230 selects the trapezoidalwaveform Adp2 of the drive signal COM-A.

As described above, the trapezoidal waveform Adp1 is selected in thetime period T1 and the trapezoidal waveform Adp2 is selected in the timeperiod T2. When the selected signals having the trapezoidal waveformsare supplied as a drive signal to one end of the piezoelectric element60, two ink-discharge actions in which the amount of discharged ink ismoderate are performed through the nozzle 651 corresponding to thepiezoelectric element 60. Accordingly, two ink-droplets land on theprinting medium P and are combined with each other. As a result, alarge-sized dot is formed as defined by the data signal Data.

When the data signal Data is (0, 1), the logic level of the selectsignal Sa is H during the time period T1 and the logic level of theselect signal Sb is L. Accordingly, the transfer gate 234 a is turned onand the transfer gate 234 b is turned off. Thus, the trapezoidalwaveform Adp1 of the drive signal COM-A is selected in the time periodT1. Furthermore, the logic level of the select signal Sa is L during thetime period T2 and the logic level of the select signal Sb is H.Accordingly, the trapezoidal waveform Bdp2 of the drive signal COM-B isselected.

Thus, a moderate amount of ink and a small amount of ink are dischargedin order, in such a manner that two ink-discharge actions are performed.Accordingly, two ink-droplets land on the printing medium P and arecombined with each other. As a result, a medium-sized dot is formed asdefined by the data signal Data.

When the data signal Data is (1, 0), the logic levels of both the selectsignals Sa and sb are L during the time period T1. Accordingly, both thetransfer gates 234 a and 234 b are turned off. Thus, neither thetrapezoidal waveform Adp1 nor the trapezoidal waveform Bdp1 is selectedin the time period T1. When both the transfer gates 234 a and 234 b areturned off, a path which extends from the connection point between theoutput terminals of the transfer gates 234 a and 234 b to one end of thepiezoelectric element 60 is in a high-impedance state in which the pathis not electrically connected any portion. However, in this case, thepiezoelectric element 60 holds the voltage (Vc-V_(BS)) immediatelybefore the transfer gate is turned off, because the piezoelectricelement 60 itself is capacitive.

Subsequently, in the time period T2, the logic level of the selectsignal Sa is L and the logic level of select signal Sb is H.Accordingly, the trapezoidal waveform Bdp2 of the drive signal COM-B isselected. Thus, a small amount of ink is discharged through the nozzle651, only in the time period T2. As a result, a small-sized dot isformed in the printing medium P, as defined by the data signal Data.

When the data signal Data is (0, 0), the logic level of the selectsignal Sa is L during the time period T1 and the logic level of theselect signal Sb is H. Accordingly, the transfer gate 234 a is turnedoff and the transfer gate 234 b is turned on. Thus, the trapezoidalwaveform Bdp1 of the drive signal COM-B is selected in the time periodT1. Then, the logic levels of both the select signals Sa and Sb are Lduring the time period T2, and thus neither the trapezoidal waveformAdp2 nor the trapezoidal waveform Bdp2 is selected.

Therefore, in the time period T1, ink in the vicinity of the openingportion of the nozzle 651 is subjected to only fine-oscillation and inkis not discharged. As a result, a dot is not formed. In other words,non-recording is performed as defined by the data signal Data.

As described above, the selection portion 230 selects the drive signalCOM-A or the drive signal COM-B (or selects neither drive signal), inaccordance with the instruction from the selection control portion 210.Then, the selection portion 230 supplies the selected drive signal toone end of the piezoelectric element 60. As a result, the respectivepiezoelectric elements 60 are driven in accordance with the informationrelating to the size of dot, which is defined by the data signal Data.

The drive signals COM-A and COM-B illustrated in FIG. 5 are only anexample of a drive signal. Combinations of various waveforms prepared inadvance are used in accordance with a movement speed of the head unit20, properties of the printing medium P or the like.

In this embodiment, a configuration in which the piezoelectric element60 is bent upward in accordance with an increase in voltage isdescribed. However, when voltages supplied to the two electrodes 611 and612 are inverted, the piezoelectric element 60 is bent downward inaccordance with a decrease in voltage. Accordingly, in the configurationin which the piezoelectric element 60 is bent downward in accordancewith an increase in voltage, the waveforms of the drive signals COM-Aand COM-B illustrated in the accompanying drawings have a shape invertedwith respect to the voltage Vc as a reference.

In this embodiment, one dot is formed in the printing medium P, for eachtime period Ta as a unit time period, as described above. In thisembodiment in which one dot is formed by performing (up to) twoink-droplet discharge actions during the time period Ta, the inkdischarge frequency f is 2/Ta. Furthermore, the gap D between dots is avalue obtained by dividing the movement velocity v of the head unit bythe ink discharge frequency f (=2/Ta).

Generally, in a unit time period T, an ink-droplet can be discharged Q(in this embodiment, Q is an integer greater than 2) times. When anink-droplet is discharged Q times, in such a manner that one dot isformed, the ink discharge frequency f satisfies the relationship off=Q/T.

Upon comparison between a case where a different-sized dot is formed inthe printing medium P, as in the case of this embodiment, and a casewhere one dot is formed by one ink-droplet discharge action, times(periods) necessary to form one dot are the same. However, the formercase requires a reduction in time of one ink-droplet discharge action.

In a case of the third method in which the two or more ink-droplets arenot combined, in such a manner that two or more dots are formed, it isnot necessary to particularly describe the details thereof.

Next, the driving circuit 50 will be described. When schematicallydescribing the two driving circuits 50, one generates the drive signalCOM-A and the other generates the drive signal COM-B. In other words,first, one of the two driving circuits 50 analog-converts the data dAsupplied from the control portion 100. Second, the driving circuit 50causes the drive signal COM-A to be fed back and the driving circuit 50corrects, using high-frequency components of the drive signal COM-A, adifference between a signal (an attenuation signal) based on the drivesignal COM-A and a target signal. Then, the driving circuit 50 generatesa modulation signal, in accordance with the corrected signal. Third, thedriving circuit 50 performs switching of a transistor, in accordancewith the modulation signal, in such a manner that the driving circuit 50generates an amplified modulation signal. Fourth, the driving circuit 50smoothens, by a low pass filter, the amplified modulation signal, andthen the driving circuit 50 outputs, as the drive signal COM-A, thesmoothened signal.

The other of the two driving circuits 50 has the same configuration asthat of the one driving circuit 50, except that the drive signal COM-Bis output based on the data dB. For convenience of description, thedriving circuit 50 which outputs the drive signal COM-A will bedescribed below.

FIG. 10 is a view illustrating the configuration of the driving circuit50.

The driving circuit 50 is constituted of various elements, such as anLSI 500, transistors M3 and M4, a resistor, and a capacitor, asdescribed in FIG. 10.

A configuration for outputting the drive signal COM-A is illustrated inFIG. 10. However, practically, circuits of two systems for generatingboth the drive signal COM-A and the drive signal COM-B are packaged inone LSI 500.

The Large Scale Integration (LSI) 500 outputs gate signals to thetransistors M3 and M4, based on the data dA which is composed of 10 bitsand is input from the control portion 100 through pins D0 to D9.Accordingly, the LSI 500 includes a Digital to Analog Converter (DAC)502, adders 504 and 506, a summing integrator 512, an attenuator 514, acomparator 520, a NOT circuit 522, and gate drivers 533 and 534.

The DAC 502 converts, into an analog signal Aa, the data dA whichdecides the waveform of the drive signal COM-A. Then, the DAC 502supplies the analog signal Aa to the (−) input terminal of the adder504. The voltage amplitude of the analog signal Aa is set in the rangeof, for example, 0 volts to 2 volts. The voltage of the analog signal Aais amplified by 20 times and a signal having the amplified voltage isused as the drive signal COM-A. In other words, the analog signal Aa isa target signal before the amplification of the drive signal COM-A isperformed.

The summing integrator 512 attenuates and integrates a voltage, that is,the voltage of the drive signal COM-A, which is input from a terminalOut through a pin Vfb. Then, the summing integrator 512 supplies theattenuated and integrated voltage to the (+) input terminal of the adder504.

The adder 504 supplies, to one input terminal of the adder 506, thesignal Ab having a voltage which is obtained by subtracting the voltageof the (−) input terminal from the voltage of the (+) input terminal andintegrating the remainder of the subtraction.

The power-supply voltage of a circuit extending from the DAC 502 to theNOT circuit 522 is 3.3 volts (which is a voltage Vdd) of low-amplitude.The maximum voltage of the analog signal Aa is about 2 volts. However,in some cases, the maximum voltage of the drive signal COM-A is greaterthan 40 volts. Accordingly, the summing integrator 512 attenuates thevoltage of the drive signal COM-A such that, when a difference betweenthe voltages of the two signals is calculated, the amplitude ranges ofboth voltages are matched to each other.

The attenuator 514 attenuates high-frequency components of the drivesignal COM-A which is input through a pin Ifb. Then, the attenuator 514supplies the attenuated signal to the other input terminal of the adder506. The adder 506 supplies, to the comparator 520, a signal As having avoltage which is obtained by adding the voltage of the one inputterminal and the voltage of the other input terminal. Similarly to inthe case of the summing integrator 512, the attenuation by theattenuator 514 is performed to match the amplitude of a signal, duringthe feedback of the drive signal COM-A.

The voltage of the signal As which is output from the adder 506 isobtained by subtracting the voltage of the analog signal Aa from theattenuated voltage of the signal supplied through the pin Vfb and addingthe remainder of the subtraction and the attenuated voltage of thesignal supplied through the pin Ifb. Accordingly, it is possible to saythat the signal As from the adder 506 is a signal of which the voltageis obtained as follows. A difference is calculated by subtracting thevoltage of the analog signal Aa as a target signal from the attenuatedvoltage of the drive signal COM-A output from the terminal Out, and thenthe difference is corrected by the high-frequency components of thedrive signal COM-A.

The comparator 520 outputs, based on the added voltage by the adder 506,a modulation signal Ms which is pulse-modulated as follows.Specifically, the comparator 520 outputs the modulation signal Ms ofwhich the logic level is switched as follows. In a case where thevoltage of the signal As output from the adder 506 increases, when thevoltage of the As is equal to or greater than a voltage threshold Vth1,the logic level of the modulation signal Ms is switched to H. Incontrast, in a case where the voltage of the signal As output from theadder 506 decreases, when the voltage of the As is equal to or less thana voltage threshold Vth2, the logic level of the modulation signal Ms isswitched to L. The voltage thresholds satisfy the relationship ofVth1>Vth2, as described below.

The modulation signal Ms from the comparator 520 is subjected tologic-inversion by the NOT circuit 522, and then the logic-invertedmodulation signal Ms is supplied to the gate driver 534. Meanwhile, themodulation signal Ms not subjected to logic-inversion is supplied to thegate driver 533. Thus, the logic level of the signal supplied to thegate driver 533 has an exclusive relationship, with respect to the logiclevel of the signal supplied to the gate driver 534.

The logic levels of the signals supplied to the gate drivers 533 and 534may be subjected to a timing control such that, practically, both thelogic levels are prevented from becoming H at the same time (in otherwords, the transistors M3 and M4 are prevented from being turned on atthe same time). Accordingly, the exclusive relationship mentioned abovemeans that, in the strict sense, the logic levels are prevented frombecoming H at the same time (in other words, the transistors M3 and M4are prevented from being turned on at the same time).

Meanwhile, in a narrow sense, the modulation signal mentioned in thisembodiment is the modulation signal Ms. However, when the modulationsignal mentioned in this embodiment means a signal which ispulse-modulated in accordance with the analog signal Aa, an example ofthe modulation signal mentioned in this embodiment also includes anegative-logic inverted signal (which is a signal output from the NOTcircuit 522) of the modulation signal Ms. In other words, examples ofthe modulation signal which is pulse-modulated in accordance with theanalog signal Aa include not only the modulation signal Ms, but also alogic inverted signal of the modulation signal Ms and a signal subjectedto a timing control.

The modulation signal Ms is output from the comparator 520. Thus, it ispossible to say that a circuit extending to the comparator 520, which isthe circuit constituted of the DAC 502, the adders 504 and 506, thesumming integrator 512, the attenuator 514, and the comparator 520, is amodulation circuit for generating the modulation signal Ms.

In the configuration illustrated in FIG. 10, the DAC 502 converts thedata dA of a digital type into the signal Aa of an analog type. However,without the intervention of the DAC 502, the signal Aa may be suppliedfrom an external circuit, in accordance with the instruction from, forexample, the control portion 100. Both the data dA of a digital type andthe signal Aa of an analog type function as a source signal because,when the waveform of the drive signal COM-A is generated, either decidesa target value.

The gate driver 534 level-shifts a low-amplitude logic signal (L level:0 volts, H level: 3.3 volts) which is a signal output from thecomparator 520, to a high-amplitude logic signal (for example, L level:0 volts, H level, 7.5 volts). Then, the gate driver 534 outputs thelevel-shifted signal, through a pin Ldr. A voltage Vm (which is, forexample, 12 volts) is applied to a pin Gvd, as a high-potential sidevoltage of the power-supply voltage of the gate driver 534 and zerovoltage is applied to a pin Gnd, as a low-potential side voltagethereof. In other words, the pin Gvd is earthed to the ground. The pinGvd is connected to a cathode electrode of a diode D2 for preventingbackflow and an anode electrode of the diode D2 is connected to both oneend of a capacitor C12 and a pin Bst.

The gate driver 533 level-shifts a low-amplitude logic signal which is asignal output from the NOT circuit 522, to a high-amplitude logicsignal. Then, the gate driver 533 outputs the level-shifted signal,through a pin Hdr. In the power-supply voltage of the gate driver 533, ahigh-potential side voltage is the voltage applied through the pin Bstand a low-potential side voltage is the voltage applied through a pinSw. The pin Sw is connected to a source electrode of the transistor M3,a drain electrode of the transistor M4, the other end of a capacitorC12, and one end of an inductor L2.

The transistors M3 and M4 are constituted of, for example, Field EffectTransistors (FET) of an N-channel type. In the transistor M3 which is ahigh-side transistor, a voltage Vh (which is, for example, 42 volts) isapplied to a drain electrode and a gate electrode is connected, via aresistor R8, to the pin Hdr. In the transistor M4 which is a low-sidetransistor, a gate electrode is connected, via a resistor R9, to the pinLdr and a source electrode is earthed to the ground.

The other end of the inductor L2 is the terminal Out which is the outputterminal of the driving circuit 50. The drive signal COM-A is suppliedfrom the terminal Out to the head unit 20, through the flexible cable190 (see FIGS. 1 and 2).

The terminal Out is connected to one end of a capacitor C10, one end ofa capacitor C22, and one end of a resistor R4. The other end of thecapacitor C10 is earthed to the ground. As a result, a group of theinductor L2 and the capacitor C10 functions as a Low Pass Filter (LPF)which smoothens an amplified modulation signal which is generated in theconnection point between the transistor M3 and transistor M4.

The other end of the resistor R4 is connected to the pin Vfb and one endof a resistor R23. The voltage Vh is applied to the other end of theresistor R23. Accordingly, the drive signal COM-A from the terminal Outis pulled up and fed back to the pin Vfb.

Meanwhile, the other end of the capacitor C22 is connected to one end ofa resistor R5 and one end of a resistor R32. The other end of theresistor R5 is earthed to the ground. As a result, a group of thecapacitor C22 and the resistor R5 functions as a High Pass Filter (HPF)which passes high-frequency components of the drive signal COM-A fromthe terminal Out, in which the frequency of the high-frequencycomponents is equal to or higher than a cut-off frequency. The cut-offfrequency of the HPF is set to, for example, about 9 MHz.

The other end of the resistor R32 is connected to one end of a capacitorC20 and one end of a capacitor C58. The other end of the capacitor C58is earthed to the ground. As a result, a group of the resistor R32 andthe capacitor C58 functions as a Low Pass Filter (LPF) which passeslow-frequency components of the signal components passed through the HPFdescribed above, in which the frequency of the low-frequency componentsis equal to or lower than a cut-off frequency. The cut-off frequency ofthe LPF is set to, for example, about 160 MHz.

The cut-off frequency of the HPF is se to be lower than the cut-offfrequency of the LPF. Thus, the HPF and the LPF function as a BPF (BandPass Filter) which allows high-frequency components of the drive signalCOM-A, which is within a predetermined frequency range, to passtherethrough.

The other end of the capacitor C20 is connected to the pin Ifb of theLSI 500. The high-frequency components of the drive signal COM-A passedthrough the BPF is fed back to the pin Ifb, in a state wheredirect-current components of the high-frequency components are cut off.

Meanwhile, the drive signal COM-A output from the terminal Out is asignal which is obtained by smoothening, using the low pass filterconstituted of the inductor L2 and the capacitor C10, the amplifiedmodulation signal generated in the connection point (in other words, thepin Sw) between the transistor M3 and the transistor M4. The drivesignal COM-A is positive-fed back to the adder 504 through the pin Vfb,in a state where the drive signal COM-A is subjected to integration andsubtraction. Thus, the drive signal COM-A is subjected to self-excitedoscillation at a frequency which is decided according to both a delay(which is the sum of a delay resulting from smoothening by both theinductor L2 and the capacitor C10 and a delay by the summing integrator512) of feedback and a feedback transfer function.

However, the amount of delay in a feedback path passing through the pinVfb is great. Thus, when only the feedback through the pin Vfb isprovided in the driving circuit 50, it is not possible to provide anadequately high self-excited oscillation frequency at which a sufficientaccuracy of the drive signal COM-A can be ensured.

Accordingly, in addition to the feedback path passing through the pinVfb, a feedback path passing through the pin Ifb, through which thehigh-frequency components of the drive signal COM-A are fed back, isprovided in this embodiment. Thus, the delay is reduced in terms of theentirety of the circuit. As a result, upon comparison with the casewhere the feedback path passing through the pin Ifb is not provided, thefrequency of the signal As which is obtained by adding thehigh-frequency components of the drive signal COM-A to the signal Abbecomes a high frequency at which a sufficient accuracy of the drivesignal COM-A can be ensured.

FIG. 11 is a view in which both the waveform of the signal As and thewaveform of the modulation signal Ms are illustrated in association withthe waveform of the signal Aa.

The waveform of the signal As has a triangular shape, as illustrated inFIG. 11. The oscillation frequency of the signal As changes inaccordance with the voltage (which is the input voltage) of the signalAa. Specifically, when the value of the input voltage is a median, theoscillation frequency of the signal As becomes the highest. When thevalue of the input voltage increases or decreases from the median, theoscillation frequency of the signal As decreases.

In the triangular waveform of the signal As, inclination degrees of boththe ascending slope (in which the voltage increases) and the descendingslope (in which the voltage decreases) are substantially the same whenthe value of the input voltage is about the median. Thus, the duty ratioof the modulation signal Ms is approximately 50%, in which the dutyratio of the modulation signal Ms is the result of the comparisonbetween the signal As and the voltage thresholds Vth1 and Vth2, usingthe comparator 520. The inclination of the descending slope of thewaveform of the signal As becomes gentler, as the input voltageincreases from the median. As a result, the time period in which thelogic level of the modulation signal Ms is H becomes longer, and thusthe duty ratio increases. In contrast, the inclination of the ascendingslope of the waveform of the signal As becomes gentler, as the inputvoltage decreases from the median. As a result, the time period in whichthe logic level of the modulation signal Ms is L becomes shorter, andthus the duty ratio decreases.

Thus, it is possible to say that the modulation signal Ms is apulse-density modulation signal having the following characteristics.That is, when the value of the input voltage is the median, the dutyratio of the modulation signal Ms is approximately 50%. When the inputvoltage increases over the median, the duty ratio of the modulationsignal Ms increases. When the input voltage decreases below the median,the duty ratio thereof decreases.

The gate driver 533 turns on/off the transistor M3, in accordance withthe modulation signal Ms. In other words, when the logic level of themodulation signal Ms is H, the gate driver 533 turns on the transistorM3. In contrast, when the logic level of the modulation signal Ms is L,the gate driver 533 turns off the medium transistor M3. The gate driver534 turns on/off the transistor M4, in accordance with the logicinversion signal of the modulation signal Ms. In other words, when thelogic level of the modulation signal Ms is H, the gate driver 534 turnsoff the transistor M4. In contrast, when the logic level of themodulation signal Ms is L, the gate driver 534 turns on the mediumtransistor M4.

Thus, in the drive signal COM-A which is obtained by smoothening theamplified modulation signal generated in the connection point betweenthe transistors M3 and M4, using both the inductor L2 and the capacitorC10, the voltage of the drive signal COM-A increases in accordance withan increase in the duty ratio of the modulation signal Ms and thevoltage of the drive signal COM-A decreases in accordance with adecrease in the duty ratio of the modulation signal Ms. As a result, thedrive signal COM-A is controlled and output such that the voltage of thedrive signal COM-A follows, in an enlarged manner, the voltage of thesignal Aa.

A pulse-density modulation is performed in the driving circuit 50. Thus,upon comparison with a circuit in which pulse-width modulation isperformed with a fixed modulation frequency, the driving circuit 50 hasan advantage in that a large variation width of the duty ratio can beensured.

In other words, in terms of the entirety of a circuit, the minimumpositive-pulse width and the minimum negative-pulse width are regulatedby characteristics of the circuit. Thus, when a pulse-width modulationis performed with a fixed frequency, only a predetermined range (whichis a range of, for example, 10% to 90%) of the variation width can beensured in a duty ratio. However, when a pulse density modulation isperformed, the oscillation frequency gradually decreases, as the valueof the input voltage moves away from the median. Thus, a relativelylarge duty-ratio can be ensured in a high input-voltage range and arelatively small duty-ratio can be ensured in a low input-voltage range.As a result, when a self-excited oscillation type pulse-densitymodulation is performed, a relatively wide range (which is a range of,for example, 5% to 95%) of the variation width can be ensured in a dutyratio.

Furthermore, the driving circuit 50 is a self-excited oscillation typecircuit. Accordingly, the driving circuit 50 does not require a circuitfor generating a carrier wave having a high frequency, unlike aseparately-excited oscillation type circuit. As a result, the drivingcircuit 50 has an advantage in that it is easy to integrate thecomponent, in other words, the LSI 500, other than a circuit dealingwith high voltage.

Furthermore, not only the feedback circuit passing through the pin Vfbbut also the feedback path passing through the pin Ifb, through whichthe high-frequency components are fed back, are provided in the drivingcircuit 50, as a feedback path of the drive signal COM-A. Accordingly,the delay is reduced, in terms of the entirety of the circuit. As aresult, the high self-excited oscillation frequency is ensured, and thusthe driving circuit 50 can generate the drive signal COM-A with highaccuracy.

Various elements, such as a capacitor and resistor, are mounted on amultilayer substrate, in such a manner that the driving circuit 50described above is formed. Next, the mounting state of the variouselements on a print circuit substrate will be described. In addition,routing of wiring in the print circuit substrate will be described.

The print circuit substrate is a four-layer substrate. The print circuitsubstrate has a configuration in which wiring patterns of a first layer,a second layer, a third layer, and a fourth layer are stacked withinsulation layers interposed therebetween, as described below.Furthermore, the wiring patterns of different layers are appropriatelyelectrically connected through a through-hole. In this configuration,the layer means not an insulation layer but a wiring-pattern forminglayer which is provided in a portion between adjacent insulation layers.

FIG. 12 is a view illustrating a part of the wiring pattern of the firstlayer of the print circuit substrate, which is a portion in the vicinityof an area constituting the driving circuit 50. Similarly, FIGS. 13 to15 are views which respectively illustrate the wiring patterns of thesecond layer, the third layer, and the fourth layer of the print circuitsubstrate.

In FIGS. 12 to 15, the first layer, the second layer, the third layer,and the fourth layer are given to the four layers constituting the printcircuit substrate, in order from a mounting surface side. Thus, thefirst layer and the fourth layer are front-surface layers and the secondlayer and the third layer are layers other than the front-surface layer.FIGS. 12 to 15 illustrate plan views of the print circuit substrate,when seen from the mounting surface side.

In FIGS. 12 to 15, the areas illustrated by hatching are the wiringpatterns subjected to patterning using copper foil. In a wiring patternof one layer, a black circular portion is a through-hole (that is, a viahole) through which the wiring pattern of the one layer is connected toa wiring pattern of the other layer. In each layer, the area illustratedwithout using hatching is an area in which a wiring pattern is notprovided. In the area illustrated without hatching, a white circularportion is an opening portion of a through-hole which connects wiringpatterns of the other layers while preventing the wiring pattern of theone layer from being connected to the wiring patterns of the otherlayers.

In the wiring pattern of the first layer illustrated in FIG. 12, blackrectangular portions are lands (which are not terminals but connectionportions in the print circuit substrate) used for connecting variouselements. The wiring patterns of the first layer and the fourth layerwhich are the front-surface layers are protected by a solder resist (notillustrated), except for the through-hole and the land. In other words,it is possible to say that, in the print circuit substrate, the land andthe through-hole are exposed portions of the wiring pattern.

FIG. 16 is a plan view illustrating the arrangement of the elementsconstituting the driving circuit 50, in the print circuit substrate.FIG. 17 is a view illustrating the equivalent circuit of the drivingcircuit 50, in association with the arrangement of the elements mountedon the print circuit substrate. FIG. 18 is a view illustrating the pinassignment of the LSI 500, in which the pins are arranged in adual-in-line package.

To show the planar configuration of the print circuit substrate, FIGS.12 to 17 have the same scale. However, for convenience of description,the scale of FIG. 18 is larger than the scale of FIGS. 12 to 17. Pinnumbers of the LSI 500 are given as follows. “1” is given to a pinindicated by a black circular mark on the upper left side of the LSI 500in FIG. 18. “2”, “3”, “4” and so on to “48” are given incounterclockwise order, in which the pin having the pin number “1” isused as a reference pin.

In wiring of the equivalent circuit illustrated in FIG. 17, a solid lineillustrates wiring constituted by the wiring pattern of the first layer(see FIG. 12) and the broken line illustrates wirings constituted by thewiring patterns of the second layer, the third layer, and the fourthlayer.

The terminal Out which is the connection portion between the other endof the inductor L2 and one end of the capacitor C10 is connected,through the through-hole N1, to one end of a feedback wiring pattern Fbl(see FIG. 14).

FIG. 19 is a partial cross-sectional view illustrating the configurationof a part of the print circuit substrate, which is a portion in thevicinity of a through-hole N1.

A print circuit substrate 90 has a configuration in which the wiringpatterns of the first layer, the second layer, the third layer, and thefourth layer and insulating resins, such as glass epoxy, are stacked onone another. The wiring pattern of the first layer, which includes theterminal Out, is connected, through the through-hole N1, to one end ofthe feedback wiring pattern Fbl of the wiring pattern of the thirdlayer.

A wiring pattern which is connected to the terminal Out (or the feedbackwiring pattern Fbl) through the through-hole N1 is not provided in thesecond layer. Accordingly, a ground portion of the wiring pattern of thesecond layer has a pattern shape in which the ground portion is not incontact with the passing-through portion of the through-hole N1 (seeFIG. 13).

The other end of the feedback wiring pattern Fbl is connected, through athrough-hole N2, to both one end of the resistor R4 and one end of thecapacitor C12 which are provided in the wiring pattern of the firstlayer (see FIG. 17). The cross-sectional configuration of thethrough-hole N2 is substantially the same as that of the through-holeN1. Accordingly, cross-sectional configuration of the through-hole N2 isnot illustrated in the accompanying drawings. The ground portion of thewiring pattern of the second layer has a pattern shape in which, in anarea Nb, the ground portion is not in contact with the opening portionof the through-hole N2, as illustrated in FIG. 13.

In the driving circuit 50, both the path extending from the terminal Outto the pin Vfb and the path extending from the terminal Out to the pinIfb are provided as a feedback path. In the feedback path, the feedbackwiring pattern Fbl are used in both paths described above. The feedbackwiring pattern Fbl is formed in the third layer and extends from thethrough-hole N1 to the through-hole N2.

Practically, each through-hole (for example, the through-hole N1 or N2)is constituted of not a single through-hole part but a plurality ofthrough-hole parts, as can be understood from FIG. 12 and the likes. Inthe case of the through-holes N1 and N2, each through-hole N1 or N2 isconstituted of four through-hole parts. However, in a functional pointof view, it is not necessary to distinguish whether each through-hole isconstituted of a single through-hole part or a plurality of through-holeparts. Thus, in the following description, whether each through-hole isconstituted of a single through-hole part or a plurality of through-holeparts is not distinguished.

The feedback wiring pattern Fbl of the third layer is surrounded by aground wiring pattern, as illustrated in FIG. 14. When the feedbackwiring pattern Fbl of the third layer is viewed from the top, both apart of the wiring pattern of the second layer (see FIG. 13) and a partof the wiring pattern of the fourth layer (see FIG. 15), which areportions overlapping the feedback wiring pattern Fbl, are formed ofground wiring patterns.

In the third layer, the feedback wiring pattern Fbl is surrounded, in aplane direction of the substrate, by the ground wiring pattern of thethird layer. Furthermore, in a vertical direction of the substrate, thefeedback wiring pattern Fbl is surrounded by ground wiring patterns ofboth the second layer and the fourth layer.

In the circuit diagram of FIG. 10, the path extending from the terminalOut is divided into two paths which are the feedback path extending tothe pin Vfb of LSI 500 and the feedback path extending to the pin Ifb.However, practically, the path from the terminal Out extends as follows,as illustrated in FIG. 17. The path from the terminal Out of the firstlayer extends to the feedback wiring pattern Fbl, through thethrough-hole N1. Further, in a portion immediately ahead of the LSI 500,the path passing through the feedback wiring pattern Fbl extends toreturn to the first layer, through the through-hole N2. Then, the pathis divided into two paths, in which one path extends to the one end ofthe resistor R4 and the other extends to the one end of the capacitorC22. In the two paths, the path extending to the resistor R4 side is thefeedback path directed to the pin Vfb and the path extending to thecapacitor C22 side is the feedback path directed to the pin Ifb.

In the first layer, an area of the feedback path directed to the pinVfb, in which the resistor R4 is disposed, is surrounded by the groundpattern. Furthermore, a ground pattern is provided in a portion betweenone terminal and the other terminal of the resistor R4. Similarly, inthe case of the resistor R23 which pulls up the pin Vfb, theinstallation area of the resistor R23 is surrounded by a ground patternand a ground pattern is provided in a portion between terminals of theresistor R23.

In addition to the capacitor C22, the resistor R32 and the capacitor C20are provided in the feedback path directed to the pin Ifb. Similarly toin the case described above, the areas in which the elements describedabove are installed are surrounded by ground patterns and, further,ground patterns are provided in respective portions between terminals ofthe elements.

In the case of both the resistor R5 and the capacitor C58, a groundpattern is not provided in a portion between terminals thereof such thatother ends of both the resistor R5 and the capacitor C58 form grounds.

The drain electrode of the transistor M3 is connected, through athrough-hole N3, to both the wiring pattern of the third layer and thewiring pattern of the fourth layer. The wiring pattern of the thirdlayer is connected, through a through-hole N4 and the wiring pattern ofthe first layer, to the other end of the resistor R4.

The other end (in other words, the pin Sw) of the capacitor C12 isconnected, through a through-hole N5, to both the wiring pattern of thesecond layer and the wiring pattern of the fourth layer. The wiringpatterns of both the second layer and the fourth layer are connected,through a through-hole N6, to both the source electrode of thetransistor M3 and the drain electrode of the transistor M4 which are inthe first layer. The wiring pattern of the fourth layer which isillustrated in FIG. 15 and connected, through the through-hole N5, tothe other end of the capacitor C12 is connected, through a through-holeN7, to one end of the inductor L2 of the first layer.

Accordingly, portions between the through-hole N5 and the through-holeN6 are connected in parallel by the wiring patterns of the second layerand the fourth layer. A portion between the through-hole N6 and thethrough-hole N7 is connected by the wiring pattern of the fourth layer.

In the driving circuit 50, the transistors M3 and M4 are turned on/off(subjected to switching), and thus spike current of several amperesflows from the terminal Out as an output terminal to the ground, via thecapacitor C10. As a result, noises due to the spike current aresuperimposed in the ground.

However, in this embodiment, the feedback wiring pattern Fbl and the twopaths of which one is the path extending, to the pin Vfb, from thethrough-hole N2 connected to the other end of the feedback wiringpattern Fbl and the other is the path extending from the through-hole N2to the pin Ifb are surrounded by ground patterns. Elements on thefeedback path and elements of which one end is connected to the feedbackpath are operated with the ground as a reference portion. Thus,influence of the noise described above is reduced. Accordingly, in thisembodiment, it is possible to generate and output the drive signal COM-Awith high accuracy, in accordance with the signal Aa as a target signalwhile preventing operational failure due to the influence of the noisefrom occurring.

In the above description, the driving circuit 50 which generates thedrive signal COM-A is exemplified. However, the driving circuit 50 whichgenerates the drive signal COM-B has the same configuration as that ofthe driving circuit 50 for generating the drive signal COM-A. In theprint circuit substrate, the driving circuit 50 for generating the drivesignal COM-B and the driving circuit 50 for generating the drive signalCOM-A have a pattern symmetric (except for a part of the wiring patternand some through-holes) with respect to an imaginary reference line E(see FIGS. 16 to 18) connecting a 13_(th) pin and 36_(th) pin of the LSI500, as can be understood from the partial views (in FIGS. 12 to 15) ofthe driving circuit 50 for generating the drive signal COM-B.

When the LSI 500 outputs gate signals for not only the drive signalCOM-A but also for the drive signal COM-B, the data dA and the data dBare input, in a time-division manner, to, for example, the pins D0 toD9.

Next, the arrangement of the transistors M3 and M4 in the print circuitsubstrate will be described. In addition, the configuration of thetransistor M3 (M4) will be described. Transistors having the sameperformance, for example, transistors having the same model-number, areused as the transistors M3 and M4.

FIG. 20 is a plan view illustrating the mounting positions of thetransistors M3 and M4 in the print circuit substrate 90. In other words,FIG. 20 is a partially enlarged view of FIG. 12. Hatching lines areillustrated in FIG. 12. However, for clarity of illustration, hatchinglines are omitted in FIG. 20.

A wiring pattern 901 includes four lands 93 to which the drainelectrodes of the transistor M3 are connected, as illustrated in FIG.20. A plurality of through-holes 911 are provided in the wiring pattern901. The through-hole 911 has the same configuration as that of thethrough-hole N3 described above. The through-holes 911 allow the wiringpattern 901 of the first layer to be connected to both the wiringpattern of third layer (see FIG. 14) and the wiring pattern of thefourth layer (see FIG. 15). Furthermore, the voltage Vh is applied tothe wiring pattern 901.

The drain electrode of the transistor M3 (or M4) has a function of anelectrode and a function for dissipating heat of the transistor, asdescribed below. Accordingly, the heat generated in the transistor M3 istransferred, via the drain electrode, to the wiring pattern 901 of thefirst layer. Furthermore, the heat generated in the transistor M3 istransferred, via the through-hole 911 (in other words, the through-holeN3), to both the wiring pattern of the third layer and the wiringpattern of the fourth layer. As a result, the heat is released by thewiring patterns described above.

A land 91 is provided to connect the gate electrode of the transistor M3and a land 92 is provided to connect the source electrode of thetransistor M3.

A wiring pattern 902 having the land 92 includes four lands 93 and aplurality of through-holes 912. The drain electrodes of the transistorM4 are connected to the four lands 93. The configuration of thethrough-hole 912 is the same as that of the through-hole N6 describedabove. The wiring pattern 902 of the first layer is connected, throughthe through-holes 912, to both the wiring pattern of the second layerand the wiring pattern of the fourth layer. A part of the wiring pattern902 forms the terminal Out.

When the transistor M4 is mounted, the heat generated in the transistorM4 is transferred, via the drain electrode, to the wiring pattern 902 ofthe first layer. Furthermore, the heat generated in the transistor M3 istransferred, via the through-hole 912 (in other words, the through-holeN4), to both the wiring pattern of the second layer and the wiringpattern of the fourth layer. As a result, the heat is released by thewiring patterns described above.

The arrangement density of the through-holes 912 in the wiring pattern902 is higher than that of the through-holes 911 in the wiring pattern901. The reason for this is that the area of the wiring pattern 902 issmaller than that of the wiring pattern 901, as can be understood fromFIG. 12 and the like. Specifically, in the case of the wiring pattern902, it is necessary to effectively transfer heat to the wiring patternsof the other layers.

The size of a gap between adjacent through-holes is as follows. In thecase of the through-holes 911, the size of a gap is approximately 0.75mm. In the case of the through-holes 912, the size of a gap is smallerthan 0.75 mm. In the transistor M3 (or M4), a distance between drainelectrodes (in other words, the lands 93) which face each other withboth the gate electrode (in other words, the land 91) and the sourceelectrode (in other words, the land 92) interposed therebetween isapproximately 5.0 mm, as illustrated in FIG. 20. The thickness of themetal-plating of a through-hole is approximately 35 μm.

FIG. 21 is a perspective view illustrating the appearance of thetransistor M3. FIGS. 22A and 22B are cross-sectional views illustratingthe configurations of the transistor M3 and the likes.

The transistor M3 includes a die (in other words, a bare chip) 70 and aclip 74, as illustrated in FIGS. 21 to 22B. A drain pad (in other words,a first electrode) 72D is provided in the rear surface (which is theupper-side surface in FIGS. 21 to 22B) of the die 70. Both a gate pad(in other words, a second electrode) 72G and a source pad (in otherwords, a third electrode) 72S are provided in the mounting surface(which is the lower-side surface in FIGS. 21 to 22B) of the die 70.

The clip 74 has a rectangular shape, when viewed from the top. The clip74 has an accommodation surface 74 a which is dented toward a sideopposite to the mounting surface side such that the die 70 isaccommodated in the dented portion. The clip 74 is formed of a material,such as copper, having both favorable electric conductivity and thermalconductivity. The rear surface of the die 70 is bonded, usingdie-bonding agent P, to the accommodation surface 74 a. Facing two sidesof the clip 74 have fin shapes and the fin-shaped portions are terminals74D.

Accordingly, in the transistor M3, the gate pad 72G functions as a gateelectrode for allowing the transistor M3 to be connected to an externalside, the source pad 72S functions as a source electrode, and theterminal 74D which is a part of the clip 74 functions as a drainelectrode.

The position of the bottom surface of the terminal 74D of the clip 74and the positions of the bottom surfaces of both the gate pad 72G andthe source pad 72S of the die 70 are substantially aligned (such thatthe bottoms surfaces thereof are arranged in one plane). Theabove-described bottom surfaces of the transistor M3 are positioned withrespect to a print circuit substrate 90 and are subjected to soldering,as illustrated in FIG. 22B. As a result, the gate pad 72G is connectedto the land 91 as a second land of the print circuit substrate 90, thesource pad 72S is connected to the land 92 as a third land of the printcircuit substrate 90, and the terminal 74D is connected to the land 93as a first land of the print circuit substrate 90.

When the transistor M3 is mounted on the print circuit substrate 90, thedie 70 is covered by the clip 74 such that the die 70 is prevented frombeing exposed.

In the above description, the transistor M3 is exemplified. However, theconfiguration of the transistor M4 is the same as that of the transistorM3.

FIG. 23 is a view illustrating the equivalent circuit of the transistorM3 (or M4). However, without being limited to the transistor M3 (or M4),the equivalent circuit of FIG. 23 is also a general equivalent circuitof a transistor. Parasitic inductance components exist in the respectiveelectrodes of a transistor, in a series connection manner, asillustrated in FIG. 23. Specifically, in the transistor, a parasiticinductance Lg exists in a gate electrode, a parasitic inductance Ldexists in a drain electrode, and a parasitic inductance Ls exists in asource electrode. Although both a parasitic resistance component and aparasitic capacitive component exist in each electrode of thetransistor, the components are not illustrated in FIG. 23.

When the transistors M3 and M4 are subjected to switching to generatethe drive signal COM-A, as in the case of this embodiment, currentsteeply flows in a portion between the drain electrode and the sourceelectrode or current is cut off. When a parasitic inductance,particularly, the inductance Ld or the inductance Ls, in each electrodeof the transistor M3 (or M4) is large, voltage noise, such as overshoot(or undershoot), occurs in the waveform of the voltage between the drainelectrode and the source electrode, as illustrated in FIG. 24A.

When the sum of the inductance Ld and the inductance Ls is set to L, avoltage V between a drain electrode and the source electrode satisfiesthe relationship of L(di/dt). As a result, the voltage noise isinfluenced by not only the inductance L but also by a frequency.

When the transistors M3 and M4 are subjected to switching at highfrequency such that the drive signal COM-A (or COM-B) is generated withhigh accuracy, voltage is likely to easily occur. When such a voltagenoise occurs, the noise components, along with regular pulse components,are smoothened by both the inductor L2 and the capacitor C10. Then, thesmoothened noise components are input, through the feedback paths, toboth the pin Vfb and the pin Ifb of the LSI 500. Accordingly, when themodulation signal Ms is generated, errors occur. Therefore, thetransistors M3 and M4 are subjected to incorrect-switching (for example,double trigger in which both transistors are turned on at the sametime). As a result, the accuracy of the waveform of the drive signalCOM-A as an output signal is reduced and, further, electric powerconsumption increases in the driving circuit 50.

In the driving circuit 50 applied to the printing apparatus 1 of thisembodiment, the gate pad 72G of the die 70 is connected to the land 91of the print circuit substrate 90 and the source pad 72S is connected tothe land 92. In other words, the source electrode and the gate electrodeof the die 70 are mounted to the print circuit substrate 90, in aface-down-bonding manner. Furthermore, the drain pad 72D is connected tothe land 93 through the clip 74. Thus, upon comparison with a transistorof a type having a bonding wire and a lead, parasitic inductancecomponents are reduced in respective electrodes of the transistor M3 (orM4). Therefore, overshoot or the like can be prevented from occurring,as illustrated in FIG. 24B. As a result, in the driving circuit 50, theaccuracy of the waveform of the drive signal COM-A can be prevented frombeing reduced and, further, electric power consumption can be preventedfrom increasing.

Heat generated in the die 70 is directly transferred to the printcircuit substrate 90 via the mounting surface and, further, the heat istransferred, through the clip 74, from the rear surface of the die 70 tothe print circuit substrate 90. Then, the transferred heat is releasedby the print circuit substrate 90. In other words, heat generated in die70, due to switching (in the strict sense, due to the current flowing atthe time of turning on the transistor) is transferred to the printcircuit substrate 90 via both surfaces of the die 70. As a result, theefficiency of transferring heat generated in the transistor M3 (or M4)increases.

Furthermore, in the print circuit substrate 90, the vicinities of thetransistors M3 and M4 are connected, through the through-holes 911, 912,and 913 (see FIG. 20), to not only the wiring pattern of the first layerbut also to the wiring patterns of the other layers. Specifically, thewiring pattern 901 connected to the drain electrode of the transistor M3is connected, through the through-hole 911, to both the third layer andthe fourth layer. The wiring pattern 902 connected to both the sourceelectrode of the transistor M3 and the drain electrode of the transistorM4 is connected, through the through-hole 912, to both the second layerand the fourth layer. A wiring pattern 903 connected to the sourceelectrode of the transistor M4 is connected, through a through-hole 913,to the ground patterns of the second layer, the third layer, and thefourth layer. As a result, heat dissipation efficiency is increased inthe print circuit substrate 90.

When dots having different sizes are formed onto the printing medium P,it is necessary to reduce the time for performing two ink-dropletdischarge actions. In other words, it is necessary to increase the inkdischarge frequency f. Thus, heat and noise are likely to becomeproblems. However, in this embodiment, heat and noise can be effectivelyprevented from occurring by, particularly, the transistors M3 and M4.

Next, the arrangement and the mounted state of the capacitor C10 in theprint circuit substrate 90 will be described.

FIG. 25 is a perspective view illustrating the external configuration ofthe capacitor C10. FIG. 26 is an end view illustrating the mounted stateof the capacitor C10.

The capacitor C10 is a so-called chip capacitor and is mounted on thefront-surface of the print circuit substrate 90, as illustrated in FIGS.25 and 26. The capacitor C10 has a configuration in which a dielectricbody 84 is interposed between two external electrodes 82. The internalconfiguration of the capacitor C10 is not illustrated in theaccompanying drawings and, further, is not described in detail. However,a laminated ceramic chip capacitor in which, for example, dielectriclayers and a pair of external electrodes 82 having a comb shape arelaminated on one another, is used as the capacitor C10.

In the capacitor C10, one of the external electrodes 82 is connected toa land 924 in the wiring pattern including the terminal Out and theother is connected to a land 922 in the ground wiring pattern, asillustrated in FIG. 26.

FIG. 27 is a view illustrating the equivalent circuit of the capacitorC10. However, without being limited to the capacitor C10, the equivalentcircuit of FIG. 27 is also a general equivalent circuit of a capacitor.

Parasitic inductances La and Lb exist in respective electrodes of acapacitor, in a series connection manner, as illustrated in FIG. 27.Although both a parasitic resistance component and a parasiticcapacitive component exist in each electrode of the capacitor, thecomponents are not illustrated in FIG. 27.

The capacitor C10, along with the inductor L2, smoothen the amplifiedmodulation signal, in other words, switching current, generated in theconnection point (in other words, the pin Sw) between the transistor M3and the transistor M4. Accordingly, when the parasitic inductancecomponent is large in the capacitor C10, similarly to in the case of thetransistor M3 or M4, voltage noise, such as overshoot, occurs. When thevoltage noise is input, through the feedback paths, to both the pin Vfband the pin Ifb of the LSI 500, the transistors M3 and M4 are subjectedto incorrect-switching. As a result, similarly to in the case of thetransistors M3 and M4, the accuracy of the waveform of the drive signalCOM-A is reduced and, further, electric power consumption increases inthe driving circuit 50.

In the driving circuit 50 applied to the printing apparatus 1, thecapacitor C10 is a leadless type capacitor, in other words, aleadless-type chip capacitor. One of the two external electrodes 82 isconnected, in a soldering manner, to the land 922 of the print circuitsubstrate 90 and the other is connected, in a soldering manner, to theland 924. Accordingly, upon comparison with a capacitor of a type havinga lead, the inductances La and Lb are reduced in the capacitor C10.Therefore, overshoot or the like can be prevented from occurring. As aresult, the accuracy of the waveform of the drive signal COM-A can beprevented from being reduced and, further, electric power consumptioncan be prevented from increasing.

In the print circuit substrate 90, the capacitor C10 is arranged asfollows. When the capacitor C10 is viewed from the top, as illustratedin FIG. 16, the capacitor C10 is mounted on the print circuit substrate90, in a state where an imaginary line F connecting the pair of externalelectrodes 82 of the capacitor C10 is substantially parallel to the lineE.

In the two external electrodes 82, the external electrode 82 connectedto the land 922 of the ground pattern is located further in the LSI 500side than the external electrode 82 connected to the terminal Out. Inthe two lands of the print circuit substrate 90, which are the landsconnected to the capacitor C10, the land 922 of the ground pattern islocated, in the driving circuit 50, closer to the LSI 500, compared tothe land 924 which functions as an output terminal. As a result, theimpedance of the ground pattern extending from the land 922 to the LSI500 is reduced.

In the driving circuit 50, the transistors M3 and M4 are subjected toswitching, and thus spike current of several amperes flows to theground, as described above. As a result, noises due to the spike currentare superimposed in the ground. However, in this embodiment, theimpedance of the ground pattern extending from the land 922 to the LSI500 is reduced, and thus the influence by the noises can be prevented.

The invention is not intended to be limited by the embodiment describedabove. The invention can be modified in various ways. One or moreselected from the modification examples described below can be usedalone or in combination.

In the this embodiment, the driving circuit 50 has a configuration inwhich, when the modulation signal Ms is generated, the drive signalCOM-A (or COM-B) which is obtained by smoothening the amplifiedmodulation signal by the low pass filter is fed back. However, thedriving circuit 50 may have a configuration in which the modulationsignal Ms itself is fed back. Although not illustrated, a differencebetween the modulation signal Ms and the signal As is calculated, andthen a signal delayed by the difference and the signal Aa as a targetsignal are subjected to addition or subtraction to obtain a signal. Theobtained signal may be used as an input signal of the comparator 520.

The only difference between the amplified modulation signal generated inthe connection point (in other words, the pin Sw) between the transistorM3 and the transistor M4 and the modulation signal Ms is logicamplitude. Thus, the amplified modulation signal is subjected toattenuation, and then the attenuated amplified modulation signal may befed back, similarly to in the case of the modulation signal Ms.

In the embodiment, the print circuit substrate 90 is constituted of thefour layers. However, the print circuit substrate 90 may be constitutedof layers, for example, six layers, other than four layers. When theprint circuit substrate 90 is constituted of six layers, the feedbackwiring pattern Fbl may be formed in, for example, a fourth layer, in astate where the feedback wiring pattern Fbl is surrounded by a groundpattern, and ground patterns may be formed in both a third layer and afifth layer. In this case, ground patterns may be formed in, in additionto the third layer and the fifth layer, a second layer and a sixthlayer.

In the embodiment, the drive signal COM-A and the drive signal COM-B areseparately generated by the two driving circuits 50. Next, either thedrive signal COM-A or the drive signal COM-B (or neither signal) isselected by the selection portion 230, and then the selected signal issupplied to one end of the piezoelectric element 60. However, forexample, four trapezoidal waveforms are repeated in one drive signal andone or more waveforms may be supplied, alone or in combination, to oneend of the piezoelectric element 60 in accordance with the size of thedot, which is defined by the data signal Data.

What is claimed is:
 1. A liquid discharging apparatus comprising: amodulation circuit that generates a modulation signal that is obtainedby pulse-modulating a source signal; a transistor that generates anamplified modulation signal by amplifying the modulation signal; a lowpass filter that generates a drive signal by smoothening the amplifiedmodulation signal; a piezoelectric element that is displaced byreceiving the drive signal; a cavity of which the internal volumechanges in accordance with the displacement of the piezoelectricelement; a nozzle through which liquid in the cavity is discharged inaccordance with change in the internal volume of the cavity; and acircuit substrate on which the modulation circuit, the transistor, andthe low pass filter are mounted, wherein the transistor includes, afirst electrode, a second electrode, and a third electrode; and a clipthat has conductivity, is bonded to one surface of a die constitutingthe transistor, and is electrically connected to the first electrode,wherein the second electrode and the third electrode are provided on theother surface of the die, wherein the circuit substrate has a first landcorresponding to the first electrode, a second land corresponding to thesecond electrode, and a third land corresponding to the third electrode,wherein the first electrode of the transistor is connected to the firstland and the second electrode is connected to the second land, wherein apart of the clip is connected to the first land, wherein, in the circuitsubstrate, a through-hole is provided in an area adjacent to a mountinglocation of the transistor, wherein the clip is connected to the circuitsubstrate and the clip completely covers and surrounds the die, thefirst electrode, the second electrode, and the third electrode, whereinthe circuit substrate includes a plurality of substrate layers and aplurality of wiring patterns, wherein each of the plurality of wiringpatterns is connected to each of the plurality of substrate layers,wherein the plurality of wiring patterns includes a first wiringpattern, a second wiring pattern, and a third wiring pattern, whereinthe first wiring pattern is connected to the first land, the secondwiring pattern is connected to the second land, and the third wiringpattern is connect to the third land, and wherein each of the firstland, the second land, and the third land is connected to each of theplurality of substrate layers by way of respective wiring pattern. 2.The liquid discharging apparatus according to claim 1, wherein thefrequency of the modulation signal is in the range of 1 MHz to 8 MHz. 3.The liquid discharging apparatus according to claim 1, wherein a signalbased on the modulation signal, the amplified modulation signal, or thedrive signal is fed back to the modulation circuit, in such a mannerthat the modulation circuit generates the modulation signal.
 4. A headunit comprising: a piezoelectric element that is displaced by receivinga drive signal; a cavity of which the internal volume changes inaccordance with the displacement of the piezoelectric element; and anozzle through which liquid in the cavity is discharged in accordancewith change in the internal volume of the cavity, wherein the drivesignal is obtained by smoothening an amplified modulation signal by alow pass filter, wherein the amplified modulation signal is obtained byamplifying a modulation signal by a transistor, wherein the modulationsignal is obtained by pulse-modulating a source signal by a modulationcircuit, wherein the modulation circuit, the transistor, and the lowpass filter are mounted on a circuit substrate, wherein the transistorincludes, a first electrode, a second electrode, and a third electrode;and a clip that has conductivity is bonded to one surface of a dieconstituting the transistor, and is electrically connected to the firstelectrode, wherein the second electrode and the third electrode areprovided in the other surface of the die, wherein the circuit substratehas a first land corresponding to the first electrode, a second landcorresponding to the second electrode, and a third land corresponding tothe third electrode, wherein the first electrode of the transistor isconnected to the first land and the second electrode is connected to thesecond land, wherein a part of the clip is connected to the first land,wherein, in the circuit substrate, a through-hole is provided in an areaadjacent to a mounting location of the transistor, wherein the clip isconnected to the circuit substrate and the clip completely covers andsurrounds the die, the first electrode, the second electrode, and thethird electrode, wherein the circuit substrate includes a plurality ofsubstrate layers and a plurality of wiring patterns, wherein each of theplurality of wiring patterns is connected to each of the plurality ofsubstrate layers, wherein the plurality of wiring patterns includes afirst wiring pattern, a second wiring pattern, and a third wiringpattern, wherein the first wiring pattern is connected to the firstland, the second wiring pattern is connected to the second land, and thethird wiring pattern is connect to the third land, and wherein each ofthe first land, the second land, and the third land is connected to eachof the plurality of substrate layers by way of respective wiringpattern.
 5. A control method of a liquid discharging apparatus that hasa piezoelectric element that is displaced by receiving a drive signal, acavity of which the internal volume changes in accordance with thedisplacement of the piezoelectric element, and a nozzle through whichliquid in the cavity is discharged in accordance with change in theinternal volume of the cavity, wherein a modulation circuit, atransistor, and a low pass filter are mounted on a circuit substrate,wherein the modulation circuit generates a modulation signal that isobtained by pulse-modulating a source signal, wherein the transistorgenerates an amplified modulation signal by amplifying the modulationsignal, wherein the low pass filter generates the drive signal bysmoothening the amplified modulation signal, wherein the transistorincludes, a first electrode, a second electrode, and a third electrode;and a clip that has conductivity, is bonded to one surface of a dieconstituting the transistor, and is electrically connected to the firstelectrode, wherein the second electrode and the third electrode areprovided in the other surface of the die, wherein the circuit substratehas a first land corresponding to the first electrode, a second landcorresponding to the second electrode, and a third land corresponding tothe third electrode, wherein the first electrode of the transistor isconnected to the first land and the second electrode is connected to thesecond land, wherein a part of the clip is connected to the first land,wherein, in the circuit substrate, a through-hole is provided in an areaadjacent to a mounting location of the transistor, wherein the clip isconnected to the circuit substrate and the clip completely covers andsurrounds the die, the first electrode, the second electrode, and thethird electrode, wherein the circuit substrate includes a plurality ofsubstrate layers and a plurality of wiring patterns, wherein each of theplurality of wiring patterns is connected to each of the plurality ofsubstrate layers, wherein the plurality of wiring patterns includes afirst wiring pattern, a second wiring pattern, and a third wiringpattern, wherein the first wiring pattern is connected to the firstland, the second wiring pattern is connected to the second land, and thethird wiring pattern is connect to the third land, and wherein each ofthe first land, the second land, and the third land is connected to eachof the plurality of substrate layers by way of respective wiringpattern.